Mobile QR Code QR CODE


Compagnoni C. M., Goda A., Spinelli A. S., Feeley P., Lacaita A. L., Visconti A., Sept. 2017, Reviewing the Evolution of the NAND Flash Technology, Proc of the IEEE, Vol. 105, No. 9, pp. 1609-1633DOI
Aochi H., 2009, BiCS Flash as a Future 3D Non-Volatile Memory Technology for Ultra High Density Storage Devices, IEEE International Memory Workshop (IMW), pp. 1-2DOI
Hsu T.-H., Lue H.-T., Du P.-Y., Chen W.-C., Yeh T.-H., Lo R., Chang H.-S., Wang K.-C., Lu C.-Y., May 2019, Study of self-healing 3D NAND flash with micro heater to improve the performances and lifetime for fast NAND in NVDIMM applications, IEEE 11th International Memory Workshop (IMW), pp. 1-4DOI
Lee K.-S., Park J.-Y., Jun. 2021, Inner Spacer Engineering to Improve Mechanical Stability in Channel-Release Process of Nanosheet FETs, Electronics, Vol. 10, No. 12, pp. 1395DOI
Jung W.-J., Park J.-Y., Oct. 2021, Dielectric Engineering to Suppress Cell-to-Cell Programming Voltage Interference in 3D NAND Flash Memory, Micromachines, Vol. 12, No. 11, pp. 1297DOI
Lue H.-T., Du P.-Y., Chen C.-P., Chen W.-C., Hsieh C.-C., Hsiao Y.-H., Shih Y.-H., Lu C.-Y., Dec. 2012, Radically extending the cycling endurance of flash memory (to > 100 M cycles) by using built-in thermal annealing to self-heal the stress-induced damage, in Proc. IEEE Int. Electron Devices Meeting (IEDM), pp. 9.1.1-9.1.4DOI
Park J.-Y., Moon D.- I., Seol M.-L., Jeon C.-H., Jeon G.-J., Han J.-W., Kim C.-K., Park S.-J., Lee H.-C., Choi Y.-K., Jan. 2016, Controllable electrical and physical breakdown of poly-crystalline silicon nanowires by thermally assisted electromigration, Sci. Rep. Art. no. 19314DOI
Kim M.-K., Choi Y.-K., Park J.-Y., Jan. 2022, Power Reduction in Punch-Through Current-Based Electro-Thermal Annealing in Gate-All-Around FETs, Micromachines, Vol. 13, No. 1DOI
Park J.-Y., Moon D.-I., Seol M.-L., Kim C.-K., Jeon C.-H., H.-Bae , Bang T., Choi Y.-K., Mar. 2016, Self-curable gate-all-around MOSFETs using electrical annealing to repair degradation induced from hot-carrier injection, IEEE Trans. Electron Devices, Vol. 63, No. 3, pp. 910-915DOI
Park J.-Y., Yun D.-H., Kim S.-Y., Choi Y.-K., Feb. 2019, Suppression of Self-Heating Effects in 3-D V-NAND Flash Memory using a Plugged Pillar-Shaped Heat Sink, IEEE Electron Device Lett., Vol. 40, No. 2, pp. 212-215DOI
Jung D.-H., Lee K.-S., Park J.-Y., Oct. 2021, Demonstration of Multi-layered Macaroni Filler for Back-Biasing-Assisted Erasing Configuration in 3D V-NAND, J. Semicond. Technol. Sci., Vol. 21, No. 5DOI