Mobile QR Code QR CODE

“JSTS has been indexed and abstracted in the SCIE (Science Citation Index Expanded) since Volume 9, Issue 1 in 2009. Furthermore, it continues to maintain its listing in the SCOPUS database and is recognized as a regular journal by the Korea Research Foundation.

※ The user interface design of www.jsts.org has been recently revised and updated. Please contact inter@theieie.org for any inquiries regarding paper submission.

Journal Search

  1. Home
  2. Archive
  3. JSTS 2022-06(Vol.22 No.03)
XML PDF INFO REF
Title Investigation of Mechanical Stability during Electrothermal Annealing in a 3D NAND Flash Memory String
Authors (Yu-Jin Kim) ; (Jun-Young Park)
DOI https://doi.org/10.5573/JSTS.2022.22.3.139
Page pp.139-145
ISSN 1598-1657
Keywords Electro-thermal annealing; degradation; Joule heat; mechanical stress; reliability; 3D NAND flash memory
Abstract Simulation studies are performed for better mechanical stability during using electro-thermal annealing (ETA) in 3D NAND flash memory. It is revealed that the mechanical stress is closely associated with the cell temperature and thermal expansion characteristic. Based on the thermal and material knowledges, various approaches for reducing the mechanical stress are proposed in terms of modification of bias configuration, alternative materials, and novel structure.