KimKyeongjun1
LeeSeonghearn1
-
(Department of Electronic Engineering, Hankuk University of Foreign Studies, Mohyeon-eup,
Yongin-si, Gyeonggi-do 17035, Korea)
Copyright © The Institute of Electronics and Information Engineers(IEIE)
Index Terms
FB PD-SOI, SOI MOSFET, RF inductive effect, kink effect, S-parameter
I. Introduction
High resistivity (HR) partially depleted (PD) silicon-on-insulator (SOI) MOSFETs have
a great advantage in RF SoC fabrication due to low cross-coupling, low cross-talk
noise, and low leakage current. When the drain-source voltage VDS becomes higher
in floating body (FB) PD SOI n-MOSFETs, the impact ionization hole current Iimp
generated in the pinch-off region flows into the grounded source, causing an increase
in the internal body voltage VBi as shown in Fig. 1(a). This rise in VBi leads to a decrease in the threshold voltage Vth, resulting
in an increase in the channel current Ich, so called ``kink effect'' [1-5].
Fig. 1. The cross-section of (a) FB PD-SOI n-MOSFET; (b) BCT PD-SOI n-MOSFET.
The DC kink voltage Vkink, which indicates the VDS value at which the kink
effect starts to occur, decreases as the channel length decreases due to the reduction
in the drain-source saturation voltage VDSAT, and the sub-bandgap Vkink
decreases to 0.6V below Eg/q of 1.12V in Si as the mask gate length Lg
is scaled down to 0.13μm [6].
PD-SOI n-MOSFETs used in this study have the body doping concentration of 6×1017cm−3, the Si body thickness of 80 nm, and the gate oxide thickness of
2.8~nm. In order to reduce the parasitic gate resistance for the purpose of improving
RF and noise performances, the devices use multi-finger geometry with multiple polysilicon
gate fingers. In Fig. 2, which shows the IDS−VDS curve of a multi-finger FB PD-SOI n-MOSFET with
the gate length Lg of 0.1 μm, unit gate finger width Wu of 10 μm,
and the number of gate finger Nf of 16, Vkink is measured to be approximately
0.55V at VGS=0.5V.
Fig. 2. Comparison between measured IDS−VDS curves of FB and BCT PD-SOI
n-MOSFETs.
This reduction in Vkink may be a significant issue when designing low-power ICs
that require a lower operating voltage. The significantly increased breakdown current
at VDS>1.7V shown in Fig. 2 appears to be caused by the punch-through leakage current that arises from merged
source-body and drain-body depletion regions at the high VDSrange.
To mitigate the non-linearity caused by the kink effect, body contact (BCT) PD-SOI
devices in Fig. 1(b) have been utilized [7-16]. However, as the Wu/Lg ratio of gate finger increases, an increase in IDS
still occurs at a much higher VDS (Vkink=1.2V at VGS=0.5V) than that
in FB devices as shown in Fig. 2. This phenomenon, similar to the kink effect, is caused by an increase in the internal
body voltage (VBi=IimpRbody) across the body resistance Rbody that
linearly increases with the Wu/Lg of BCT devices in Fig. 1(b) [14]. The increase in VBi leads to a decrease in Vth, resulting in the rise
of Ich, so called a substrate current-induced body effect (SCBE) [14].
Recently, in the BCT device, it has been demonstrated that an anomalous RF inductive
effect originating from negative capacitance by SCBE appears at the drain when a higher
VDS than Vkink is applied [14]. Due to this effect, the S21 and S22-parameters rotate clockwise in the
lower and upper semicircles on the Smith chart, respectively, as the frequency increases.
Also, research has been conducted to analyze this effect physically and to model it
using a small-signal equivalent circuit [14]. In addition, research has been conducted on how to effectively extract these parameters
using a simple RF inductive model with an RLC resonant circuit in BCT devices [15,16].
Fig. 3 shows the measured S22-parameters of our FB and BCT PD-SOI n-MOSFETs with the
IDS−VDS characteristics in Fig. 2. In Fig. 3, similar RF inductive effects are observed in both FB and BCT devices. As shown in
Fig. 3, the starting point at the minimum measurement frequency (10MHz) in the rotating
trajectory shifts to the left as VDS increases. Additionally, this trajectory
rotates in a clockwise direction and its radius increases. As verified previously
in a BCT device [14], this RF inductive effect in the FB device is also caused by the negative capacitance
shown in Fig. 4, where the output drain-source capacitance of Cout is determined from (1/ω)Imag(Y22) converted from measured S-parameters. It
is revealed that this negative capacitance arises from impact ionization, using an
output AC equivalent circuit of Fig. 5 that is similar to one in a BCT device [14], with the only difference being that Rbody becomes infinite in the FB device.
Fig. 3. Admittance Smith chart for the measured S22 -parameters of (a) FB PD-SOI
n-MOSFET; (b) BCT PD-SOI n-MOSFET at VGS=0.5V , with varying VDS in the
frequency range of 0.01∼20 GHz.
In the case of a BCT device with Lg=0.25μm, it has been previously reported
that the rotational trajectory of S22-parameter apparently begins to appear at
the DC Vkink of around 1.7V [14-16]. In our BCT device with Lg=0.1μm in Fig. 2, it is also observed that the RF inductive effect starts from the DC Vkink of
around 1.2V in Fig. 3(b). This is very reasonable because the negative capacitance originates from impact
ionization leading to the occurrence of the kink effect.
However, in the FB device, the rotational locus of S22-parameter from 10 MHz
is observed in Fig. 3(a) only when VDS≥1.2V, which is significantly higher than the DC Vkink
of 0.55V in Fig. 2. Unlike the BCT devices where the starting voltage of the inductive effect is about
same as DC Vkink, this VDS dependent RF inductive effect in the FB device,
which occurs at about two times higher VDS than DC Vkink, is anomalous because
the negative capacitance caused by the kink effect still exists down to 0.6V
in Fig. 4. This anomalous effect may be advantageous in the design of low-power RF ICs because
the inductive locus in Fig. 3 disappears up to the operating voltage of 1.1V. However, the physical reason
for the discrepancy between DC Vkink and the voltage at which the RF inductive
effect begins to appear has not been studied yet.
Fig. 4. Measured curve of COUT versus frequency at different VDS for an
FB PD-SOI n-MOSFET.
Therefore, in this paper, we newly analyze the VDS-dependent RF inductive effect
to reveal the origin of this anomalous discrepancy in the FB device. We focus on the
analysis of the rotation trajectory in the S22-parameter, based on the pole frequency
fpand the maximum magnitude of the output susceptance.
II. RF Inductive Effect
Fig. 5 shows the physical output equivalent circuit that considers the impact ionization
and parasitic BJT [14] for an FB PD-SOI MOSFET, where Cgd is the gate-drain capacitance, gdso
is the drain-source output conductance, Cbox is the buried oxide coupling capacitance
[17], Cbd is the body-drain junction capacitance, Cbs is the body-source capacitance,
gbs is the dynamic body-source conductance, gmb is the body transconductance,
gmp is the transconductance of parasitic BJT, and gmi is the conductance
for impact ionization current. The parasitic resistances (Rs, Rd) are omitted
in Fig. 5, because these have a negligible frequency effect on the Y22-parameter within
a few GHz in the Fig. 7 and 8.
Fig. 5. A physical output equivalent circuit for an FB PD-SOI MOSFET with kink effect
in the saturation region. Since the body is floating, Rbody is removed from
the output equivalent circuit for a BCT PD-SOI MOSFET [14].
Fig. 6. A simple output equivalent circuit for modeling the RF inductive effect.
Fig. 7. Measured Gout versus frequency curves at different VDS for an
FB PD-SOI n-MOSFET.
After deriving the negative drain-source capacitance Cdsb equation from Fig. 5, it is converted into the equivalent drain-source inductance Ldsb using −1/(ω2Cdsb)and approximated at f≫gbs/[2π(Cbs+Cbd)]
as follows [14]:
In order to analyze the VDS - dependence of the RF inductive effect in the FB
device effectively, we uses a simple RLC output equivalent circuit [15,16] in Fig. 6, where Lk is the effective inductance defined by (1), Rk is the kink resistance, gdso is the non-kink drain-source conductance,
and Ctot is the total output capacitance in Fig. 5.
The output admittance Y22 of Fig. 6 can be expressed as follows:
As the frequency increases, the output conductance Gout of (2) rapidly decreases beyond the pole frequency fp, which is calculated as Rk/(2πLk). After that, Gout becomes a constant gdso. Similarly, the
output susceptance Bout of (3) decreases in a negative direction and then increases again in a positive direction.
These trends agree well with the frequency-dependent curves shown in Fig. 7 and 8.
On the other hand, in the admittance Smith chart plot shown in Fig. 3, the S22-parameter is represented by the intersection of the constant conductance
circle and the constant susceptance circle. As the frequency increases, the conductance
and susceptance change exhibits a rotational locus on the Smith chart. In Fig. 7 and 8, it is observed that as the frequency increases, Gout decreases rapidly
and then becomes a constant, while the magnitude of negative Bout(|Bout|) increases and reaches its peak at fmin. According to the frequency dependencies
of Gout and Bout, the S22-parameter moves in a clockwise direction
on the upper side of the real axis, as shown in Fig. 3.
As the value of Gout decreases in Fig. 7, Real(S22) shifts toward the right. When Bout reaches zero,
Gout is almost minimized, and Real(S22) stops moving at the right
end. Thus, the frequency trace of the S22-parameter in Fig. 3 is shown as a clockwise-rotating curve.
To determine the VDS dependence of this RF inductive effect of the FB device
shown in Fig. 3(a), we need to consider the frequency-dependence of Gout and Bout. Specifically,
we utilize the magnitude of the minimum Bout(|Bout(min)|) and the corresponding frequency fmin. This is because the rotation radius
of the S22-parameter trajectory in Fig. 3 is determined by |Bout(min)|, and the rotation angle
is determined by fp. As shown in Fig. 3, the rotation radius and angle for the S22-parameter decrease as VDS decreases.
As a result, the RF inductive effect does not appear at VDS≤1.1V on the Smith
chart.
Fig. 8. Measured Bout versus frequency curves at different VDS for an
FB PD-SOI n-MOSFET.
Firstly, to determine |Bout(min)| in Fig. 8, we need to find fmin at which dBout/df=0 and substitute it into (3). However, this process is quite complex and difficult to derive. To avoid this problem,
we can simplify (3) by ignoring Ctot, which is much smaller than Lk/(Rk2+ω2Lk2). The fmin obtained in this way is approximated by fp
in (2):
Accordingly, substituting (4) into (3) yields:
In Fig. 7, the kink effect that causes the increase in Gout disappears at high frequencies
(HFs) where f≫fp, and Gout(HF)≈gdso as shown in
(2). Therefore, the low-frequency (LF) kink conductance Gk(LF)(=1/Rk)
is extracted by subtracting Gout(HF) from the Gout(LF)
value at the minimum measurement frequency of 10MHz. However, the measured Gout
at 10MHz below VDS=1.4V is lower than the DC value. As a result, the extracted
Gk(LF) value is inaccurate at VDS<1.4V. However, accurate Gk(LF)
values can be extracted at VDS=1.5∼1.9V.
Fig. 9 displays the extracted values of −Gk(LF)/2 compared with Bout(min)
measured from Fig. 8. In Fig. 9, −0.5Gk(LF) shows good agreement with the measured Bout(min),
with an error rate within 10%. This indicates that the term of (Rk/Lk)Ctot
in (5) is much smaller than −0.5Gk(LF). Thus, we can approximate Bout(min)
as −Gk(LF)/2.
Fig. 9. Measured Bout(min) and extracted -Gk(LF) as a function of VDS
for an FB PD-SOI n-MOSFET.
Since |Bout(min)| is progressively reduced at lower VDS
in Fig. 9, the rotation radius of the S22-parameter trajectory also continuously decreases
in Fig. 3. To explain the anomalous disappearance of the S22-parameter trajectory for
the FB device as VDS decreases in Fig. 3(a), we will conduct a physical analysis of the dependencies of VDS on Gk(LF)
and fp in the next section.
III. Analysis of Bias-dependence
The primary purposes of this section are to analyze the VDS - dependence of
Gk(LF) and fp in order to explain the invisibility of the S22-parameter
trajectory of the FB device at the bias region of 0.6V≤VDS≤1.1V in Fig. 3(a) using the rotation radius and angle for the S22- parameter.
1. Kink Conductance
From Fig. 5, Gk is derived as a function of frequency as follows [14]:
In (6), fp is given by:
In (6), Gk(LF) in the low-frequency region where f≪fp is approximated
as:
According to the kink effect, which causes the RF inductive effect, the impact ionization
body current IB(Iimp), generated by VDS in the pinch-off region, flows
to the internal body-source junction in the FB device. Due to the impact ionization
process [5,18], IB is defined as IDS(M−1), where the low-voltage thermally-assisted
impact ionization multiplication factor M is expressed by the following equation
[6].
where M0 is the value of M−1 at VDS=VDSAT+Eg/q, Eg is the energy
gap in Si, and m is the ideality factor of impact ionization.
Using (9), gmi under the condition of qIDS/(mkT)≫gdso is defined
as:
The I-V characteristic equation of the body-source junction where IB flows is
expressed as:
where Ibo is the reverse saturation base current and η is the ideality
factor of the body-source junction.
Using (11), gbs is defined as
Using (9), (10) and (12), the following equation is obtained:
Since gmp is much smaller than gmb in the kink bias [14], Gk(LF) in (8) can be approximated as (η/m)gmb using (13). This gmb can be obtained using the following formula in the saturation region:
where μn is the electron mobility, c is the channel length modulation parameter,
and the threshold voltage Vth is expressed as [19]:
where VFB is the flat-band voltage, ΨB is the surface potential, ϵs
is the permittivity of Si, Nch is the channel doping concentration, and Coxis
the gate oxide capacitance per unit channel area.
Using (14) and (15), gmb is defined as follows:
where gm is the MOSFET transconductance given by:
As VBi increases due to IB generated at high VDS, gmb also increases
in (16). In order to accurately calculate the VDS-dependent effect of gmb instead
of VBi, a relational expression between VBi and VDS is required.
Since IDS(M−1) is equal to (11), the following expression at VDS>Vkink is defined as [6]:
where m, η, Ib0, M0, and VDSAT are independent of VDS.
As VDS increases in the kink region, IDS increases and the second term of
(18) involving a logarithmic function decreases. However, this decrease is much smaller
compared to the increase of VBi in the first term. Therefore, (18) can be expressed as a linear function of VDS≈aVBi+b. Substituting
this linear function back into (16), we obtain the VDS-dependent equation of gmb=a(1+cVDS)(b−VDS)−0.5.
According to this equation, the value of Gk(LF)≈(η/m)gmb
is reduced as VDS decreases, as shown in Fig. 10.
Fig. 10. Extracted Gk(LF) data from Fig. 7 as a function of VDS for an
FB PD-SOI n-MOSFET.
Since |Bout(min)|≈0.5Gk(LF) in (5), it is verified that the reduction of |Bout(min)| with
decreasing VDS in Fig. 9 is primarily due to the VDS - dependence of gmb in (16). Accordingly, the gmb equation provides a theoretical explanation for the decrease
in the rotation radius of the S22-parameter trajectory. Based on Gk(LF)
in Fig. 10, it is confirmed that the rotation radius decreases largely from 1.8V to 1.7V,
and then gradually decreases further below 1.6V.
2. Pole Frequency
Meanwhile, Gout in Fig. 7 is measured from the minimum measurement frequency of 10MHz in our vector network
analyzer. If fp is less than 10MHz, the Gout measured at 10MHz is much
smaller than the Gk(LF) value at DC, and the Bout(min)
at fp can’t be measured. Thus, the measured |Bout| at 10MHz,
which is much less than |Bout(min)|, only represents
the latter part of the entire rotation trajectory of the S22-parameter in Fig. 3. Therefore, in order to accurately understand the VDS-dependency of the S22-parameter
rotation trajectory, fp should be measured, and it is necessary to analyze the
VDS -dependency on fp in (7).
To determine the accurate values of fp, we utilize a novel curve-fitting method
[20] based on the simple frequency-dependent Gout equation derived from (6) :
where
where fz is the zero frequency of Gk in (6) and is expressed as:
Under the kink bias, Cbd≪Cbs, because the body-drain junction is reverse-biased
and the body-source junction is forward-biased in the parasitic BJT. Under the condition
of Cbd≪Cbs, it is satisfied that gdso≫(gmb+gmp)Cbd/(Cbs+Cbd)
in (21), thus resulting in Gout(HF)=K ≈gdso. Since H ≈ Gk(LF) at fp≪fz in (20), Gk(LF)≈Gout(LF)−Gout(HF) in Fig. 7.
Since H and K at the fixed bias are constant values that are independent of frequency,
the VDS-dependent fp data is easily extracted by fitting (19) to match with the Gout versus frequency data in Fig. 7. When VDS≤1.1V, the extraction of fp data is impossible because it
is less than 10MHz. Thus, only fp data extracted at voltages above 1.2V is
shown in Fig. 11. The log(fp) increases linearly when VDS>1.2V and gradually saturates after
VDS reaches 1.5V.
Under the kink bias region, (7) can be expressed as fp≈gbs/Cbs, where Cbs is the sum of the
depletion capacitance Cjs and the diffusion capacitance Cdiff. Under forward
bias, Cjs and Cdiff are expressed as:
where Cjso is the value of Cjs when VBi=0V, Mjd is the junction
grading coefficient, Vbuilt_in is the built-in potential, βF is the
common-emitter(source) current gain, and τF is the forward transit time.
In Fig. 11, when VBi is lower than Vbuilt_in of the body-source junction, Cbs
is primarily influenced by Cjs because Cdiff≪Cjs. Since VDS
and VBi have a linear relationship in (18), Cjs in (23) is also a linear function of VDS. Additionally, gbs exponentially increases
due to impact ionization as VDSrises in (13). Thus, ln(fp) is expressed as ln(gbs)−ln(Cjs)≈CVDS−Dln(VDS)+E. Sinceln(gbs) increases more rapidly than ln(Cjs)
with rising VDS, the slope in Fig. 11 becomes approximately linear at VDS≤1.5V. However, when VBi is higher
than Vbuilt_in, Cdiff in (24) becomes dominant (Cdiff≫Cjs). Therefore, the value of fp≈gbs/Cdiff
becomes saturated at very high VDS values.
In Fig. 11, it is evident that fp is less than 10 MHz for VDS values lower than
1.1V. Accordingly, the measured Gk at 10MHz becomes negligible at VDS≤1.1V in Fig. 7, as Gout decreases rapidly for f>fp. Thus, the values of |Bout| at frequencies above 10MHz at VDS≤1.1V are much lower than |Bout(min)| shown in Fig. 9. Since fp≤10MHz at VDS≤1.1V, the rotation angle of the frequency
trajectory in the S22-parameter in Fig. 3 is substantially reduced at VDS≤1.1V compared to 180∘ at very high
VDS.
Fig. 11. Extracted fp data from Fig. 7 using (19) as a function of VDS for an FB PD-SOI n-MOSFET.
3. Physical Origin
When VDS decreases, Gk(LF) gradually reduces due to gmb.
Thus, |Bout(min)| that is approximated by Gk(LF)/2
decreases, leading to a reduction in the rotation radius of the S22-parameter
trajectory, as shown in Fig. 3. In Fig. 11, it is confirmed that fp decreases below 10MHz due to the reduction of gbs
at VDS≤1.1V. Thus, |Bout| at 10MHz becomes very small,
leading to the rotation angle of the S22-parameter being negligible when VDS<1.1V.
Accordingly, the rotational trajectory cannot be seen in the frequency response of
the S22-parameter when VDS=0.6∼1.1V in Fig. 3, even though VDS is greater than the DC Vkink of 0.55V. Through these
analyses, the origin of the invisibility of the S22-parameter trajectory in the
bias region of 0.6V≤VDS≤1.1V,where negative capacitance exists,
is clearly identified for the first time.
IV. Conclusion
In order to reveal the physical origin of the anomalous VDS - dependence in
the RF inductive effect of FB PD-SOI n-MOSFETs for the first time, the variation of
the rotation trajectory of the S22-parameter on the Smith chart at different
VDS values is newly analyzed. This new analysis is based on the frequency-dependent
equations of Gout and Bout, which are derived from an output equivalent
circuit. The accuracy of |Bout(min)|≈Gk(LF)/2,
derived from the simple RLC circuit, is verified using the Gk(LF)
extracted from the measured Gout data. We also physically proved that Gk(LF)≈(η/m)gmb. Using the physically derived equation for VDS-dependent
gmb, it is confirmed that the decreased turning radius of the S22-parameter
at lower VDS is caused by the reduction of gmb. In addition, it has been
found that fp decreases below the minimum frequency of 10MHz when VDS≤1.1V. This reduction in fp is caused by the exponential decrease in gbs
as VDS decreases. Due to the reduction in gmb and fp at lower VDS,
the RF inductive effect in the S22-parameter of FB devices does not appear at
VDS=0.6∼1.1V, which is larger than the DC Vkink, even though negative
capacitance exists.
ACKNOWLEDGMENTS
This work was supported by Hankuk University of Foreign Studies Research Fund
of 2023, and by the National Research Foundation of Korea(NRF) grant funded by the
Korea government(MSIT) (No. 2021R1A2C1095133).
References
S. S. Chen and J. B. Kuo, “An analytical CAD kink effect model of partially-depleted
SOI NMOS devices operating in strong inversion,” Solid-State Electron., vol. 41, no.
3, pp. 447-458, Mar. 1997.

S. C. Lin and J. B. Kuo, “Temperature-dependent kink effect model for partially-depleted
SOI NMOS devices,” IEEE Trans. Electron Devices, vol. 46, no. 1, pp. 254-258, Jan.
1999.

M. Y. Hammad and D. K. Schroder, “Analytical Modeling of the Partially-Depleted SOI
MOSFET,” IEEE Trans. Electron Devices, vol. 48, no. 2, pp. 252-258, Feb. 2001.

M. Kaifi and M.J. Siddiqui, “Kink model for SOI MOSFET,” in Proc. Int. Conf. on Multimedia,
Signal Processing and Communication Technologies, Dec. 2011, pp. 17-19.

P. Su, S. K. H. Fung, H. Wan, A. Niknejad, M. Chan, and C. Hu, “An impact ionization
model for SOI circuit simulation,” in Proc. IEEE Int. SOI Conf., Oct. 2002, pp. 201-202.

K. Kim and S. Lee, “Analysis of Kink Effect in Short-Channel Floating Body PD-SOI
MOSFETs,” IEEE Journal of the Electron Devices Society, vol. 11, pp. 354-358, 2023.

X. Cai and C. Hai, “Study of body contact of partial depleted SOI NMOS devices,” in
Proc. 8th Int. Conf. Solid-State and IC Tech., Oct. 2006, pp. 23-26.

Y. Omura and K. Izumi, "Simplified Analysis of Body-Contact Effect for MOSFET/SOI,"
IEEE Trans. Electron Devices, vol. 35, no. 8, pp. 1391-1393, Aug. 1988.

J. Sleight and K. Mistry, "A Compact Schottky Body Contact Technology for SOI Transistors,"
International Electron Devices Meeting (IEDM) Tech. Digest, 1997, pp. 419-422.

H. Lee, H. Nah, J.-H. Lee, D.-G. Kang, Y. J. Park, and H. S. Min, “Analysis of body
bias effect with PD-SOI for analog and RF applications,” Solid State Electron., vol.
46, no. 8, pp. 1169-1176, Aug. 2002.

O. Rozeau, J. Jomaah, J. Boussey, C. Raynaud, L. Pelloie, and F. Balestra, “Impact
of Floating Body and BS-Tied Architectures on SOI MOSFET's Radio-Frequency Performances,”
in Proc. IEEE Int. SO1 Conf., Oct. 2000, pp. 124-125.

K. Lee and S. Lee, “Empirical Kink Effect Modeling for Body Contacted High Resistivity
PD-SOI nMOSFETs,” J. Inst. Electron. Inf. Eng., vol. 55, no. 12, pp. 47-52, Dec. 2018.

K. Lee and S, Lee, “Theory and Analysis of Kink Effect in Body Contacted PD-SOI nMOSFETs,”
J. Inst. Electron. Inf. Eng., vol. 56, no. 11, pp. 15-21, Nov. 2019.

K. Lee and S. Lee, “Analysis of RF Inductive Effect in S-Parameters of Body Contact
PD-SOI MOSFETs,” IEEE Trans., Electron Devices, vol. 67, no. 10, pp. 4054-4059, Oct.
2020.

K. Lee and S. Lee, “Drain Voltage Dependence Analysis of RF Inductive Effect in Body
Contacted High Resistivity PD-SOI N-MOSFETs,” J. Inst. of Electron. Inf. Eng., vol.
58, no. 2, pp. 117-123, 2021.

K. Kim and S. Lee, “An Improved Small-Signal Equivalent Circuit Parameter Extraction
Method for Body Contact PD-SOI MOSFET with RF Inductive Effect,” J. Inst. of Electron.
Inf. Eng., vol. 60, no. 2, pp. 35-41, Feb. 2023.

J. Ahn and S. Lee, “A direct method to extract extrinsic capacitances of RF SOI MOSFETs
using common source-body and gate-body configura-tions," Microw. Opt. Technol. Lett.,
vol. 58, no. 12, pp. 2851-2853, 2016.

P. Su, K. I. Goto, T. Sugii and C. Hu, “A Thermal Activation View of Low Voltage Impact
Ionization in MOSFETs,” IEEE Electron Device Letters, vol. 23, no. 9, pp. 550-552,
Sep. 2002.

S. M. Sze and M. K. Lee, Semiconductor Devices - Physics and Technology, Wiley, 3rd
ed., 2012, p. 188.

K. Kim and S. Lee, “Analysis of AC Kink Effect in Floating Body PD-SOI MOSFETs,” in
Proc. 2023 Asia-Pacific Workshop on Advanced Semicon-ductor Devices (AWAD), July 2023,
pp. 193-194.

Kyeongjun Kim was born in Yongin, Korea, in 1995. He received the B.S. and M.S.
degrees in electronics engineering from the Hankuk University of Foreign Studies,
Yongin, Korea, in 2022 and 2024, respectively. His current research work is focused
on simulation, characterization, and SPICE modeling for RF MOSFETs.
Seonghearn Lee was born in Junjoo, Korea, in 1962. He received the B.E. degree
in electronic engineering in 1985 from Korea University, Seoul, Korea, and the M.S.
and Ph.D. degrees in electrical engineering from the University of Minnesota, Minneapolis,
in 1989 and 1992, res-pectively. His doctoral dissertation work involved the design,
fabrication, and parameter extraction of AlGaAs/GaAs heterojunction bipolar transistors.
From 1992 to 1995, he was a Senior Member of the Research Staff with the Semiconductor
Technology Division, Electronics and Telecommunications Research Institute (ETRI),
Daejeon, Korea, where he worked on the development of polysilicon emitter bipolar
transistors and Si/SiGe/Si heterojunction bipolar transistors. Since 1995, he has
been with the Department of Electronic Engineering, Hankuk University of Foreign Studies
(HUFS), Yongin, Korea, where he is currently a Professor. In 1996 and 1998, he was
an Invited Member of the Research Staff with ETRI, where he worked on RF CMOS modeling
in wireless communications applications. He served as the director of the Institute
of Information Industrial Engineering at HUFS in 2019. Since 1996, he has carried
out research on RF CMOS and bipolar compact modeling and parameter extraction for
the RF IC design. In 2013, he successfully developed SPICE model library for SOI RF
CMOS Process at the National Nanofab Center, Daejeon, Korea. In 2020, he built a novel
RF harmonic distortion breakdown model of HRS-SOI MOSFETs for RF switch IC design
through a research and development project funded by DB HiTek, Bucheon, Korea. His
research interests are in the field of characterization, parameter extraction, and
compact modeling of silicon devices for use in high-frequency ICs. Prof. Lee is a
senior member of the IEEE Electron Devices Society and a member of IEIE. He served
as a subcommittee chair at the Korean Conference on Semiconductors (KCS) from 2012
to 2013. He received the HUFS Excellence in Research Award in 2001, 2003, and 2004.
He has been listed in Who’s Who in the World and Who’s Who in Asia. He is named a
Top Scholar by ScholarGPS in 2024.