Mobile QR Code QR CODE


Weerasekera R., Pamunuwa D., Zheng L. R., Tenhunen H., Aug. 2009, Two Dimensional and Three-Dimensional Integration of Heterogeneous Electronic Systems Under Cost, Performance, and Technological Constraints, IEEE Trans. Com. Design Integrated circuits and systems, pp. 12371250DOI
Huang S., DeLaCruz J., July 2017., Improvements of System-in-Package Integration and Electrical Performance Using BVA Wire Bonding, IEEE Trans. Compon., Packag., Manuf. Technol., No. 7, pp. 10201034DOI
Swaminathan N., Cao Y., Mar. 2020., An Overview of High-Conversion HighVoltage DC-DC Converters for Electrified Avation Power Distribution System, IEEE Trans. Power Electron., Vol. 25, No. 3, pp. 614623DOI
Xu W., Li Y., Gong X., Hong Z., Killat D., July 2017., A Dual-Mode Single-Inductor Dual-Output Switching Converter With Small Ripple, IEEE Trans. Compon., Packag., Manuf. Technol., No. 7, pp. 10201034DOI
Burton E. A., et al. , Mar. 2014, FIVR-Fully integrated voltage regulators on 4th generation Intel Core SoCs, in Proc. APEC, pp. 432-439DOI
Kirshnamurthy H. K., et al. , Jan. 2018., A Digitally Controlled Fully Integrated Voltage Regulator With 3-D-TSV-Based On-Die Solenoid Inductor With a Planar Magnetic Core for 3-D-Stacked Die Applications in 14-nm TriGate CMOS, IEEE J. Solid-State Circuits, Vol. 53, No. 1, pp. 819DOI
Sun T., et al. , Jan 2020, Substrate-Embedded Low-Resistnace Solenoid Inductors for Integrated Voltage Regulators, IEEE Trans. Compon., Packag., Manuf. Technol., Vol. 10, No. 1, pp. 134-141DOI
Sun T., et al. , Oct. 2017, Substrate Embedded Thin-Film Inductors With Magnetic Cores for Integrated Voltage Regulators, IEEE Trans. Magn., Vol. 53, No. 10, pp. 8400809DOI
Ding Y., Fang X., Wu R., Sin J. K. O., Feb. 2020, A New Fan-Out-PackageEmbedded Power Inductor Technology, IEEE Trans. Electron Devices Letters., Vol. 41, No. 2, pp. 268-271DOI
Tang T., et al. , Dec. 2019, High Q-factor 3D Solenoid Inductor on InFO Package for RF System Integration, Electr. Design Adv. Packag. Syst. (EDAPS).DOI
Sturcken N., et al. , Jan. 2013, A 2.5D integrated voltage regulator using coupled magnetic-core inductors on silicon interposer, IEEE J. Solid-State Circuits, Vol. 48, No. 1, pp. 244-254DOI
Wang T., et al. , Oct. 2017., Novel Electrically Tunable Microwave Solenoid Inductor and Compact Phase Shifter Utilizing Permaloy and PZT Thin Films, IEEE Trans. Microw. Theory Techn., Vol. 65, No. 10, pp. 35693577DOI
Wu H., Zhao S., Gardner D. S., Yu H., July. 2013, Improved High Frequency Response and Quality Factor of On-Chip Ferromagnetic Thin Film Inductors by Laminating and Patterning Co-Zr-Ta-B Films, IEEE Trans. Magn., Vol. 45, No. 7, pp. 4176-4179DOI
Xy X., Li P., Cai M., Han B., Aug. 2012, Design of Novel High-Q-Factor Multipath Stacked On-Chip Spiral Inductors, IEEE Trans. Electron Devices Letters., Vol. 59, No. 8, pp. 2011-2018DOI
Sathyasree J., Vanukuru V., Nair D., Chakravorty A., Apr. 2018, Compact modeling of Proximity Effect in High-Q Tapered Spiral Inductors, IEEE Trans. Electron Devices Letter., Vol. 39, No. 4, pp. 588-590DOI
Gao Y., et al. , May. 2014., Significantly Enhanced Inductance and Quality Factor of GHz Integrated Magnetic Solenoid Inductors With FeGaB/Al2O3 Multilayer Films, IEEE Trans. Electron Devices, Vol. 61, No. 5, pp. 14701476DOI
Bellaredj M., Davis A., Kohl P., Swaminathan M., Sep. 2020, Magnetic Core Solenoid Power Inductors on Organic Substrate for System-in-Package Integrated High-Frequency Voltage Regulators, IEEE J. Emerg. Sel. Topics Power Electron., Vol. 8, No. 3, pp. 2682-2695DOI
Qu C., Zhu Z., En Y., Wang L., Liu X., Feb. 2021., Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications, IEEE Trans. Very Large Scale Integr. (VLSI) Syst., Vol. 29, No. 2, pp. 287296DOI
Gou S., Dong G., Mei Z., Yang Y., Oct. 2018, Accurate Inductance Modeling of 3-D Inductor Based on TSV, IEEE Micro. Wireless Component Letters., Vol. 28, No. 10, pp. 900-902DOI
Paul C. R., 2010, Inductance., Loop and Partial, NY, USA: WileyGoogle Search
Tiemeijer L. F., Leenaerts D., Pavlovic N., Havens R. J., Dec. 2001, Record Q spiral inductors in standard CMOS, IEEE Electorn Devices Meeting.DOI
ANSYS, Inc. 이름, ANSYS Q3D Extractor, [Online]. Available: Accessed on: Apr.URL
Agilent — Overview : Advanced Design System (ADS)., [Online].
BSIM4 Model is Described at Web Address, Accessed: Jul. 29, 2005. [Online]. Available: