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Xu. X., Karmarkar. A., 2011, 3D TCAD Modeling For Stress Management In Through Silicon Via (TSV) Stacks, AIP Conference Proceedings, Vol. 1378, No. 1, pp. 53-66DOI
Jiang. T., Wu. C. , Spinella. L. , Im. J. , Tamura. N. , Kunz. M. , Son. H.-Y., Kim. B. Gyu , Huang. R. , Ho. P. S. , 2013, Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects, Applied Physics Letters, Vol. 103, No. 21, pp. 211906DOI
Cheng H.-C., Huang T.-C., Hwang P.-W. , Chen W.-H. , 2016, Heat dissipation assessment of through silicon via (tsv)-based 3d ic packaging for cmos image sensing, Microelectronics Reliability, Vol. 59, pp. 84-94DOI
Qiu D. , Cao L. , Wang Q., Hou F., Wang X. , 2017, Experimental and numerical study of 3d stacked dies under forced air cooling and water immersion cooling, Microelectronics Reliability, Vol. 74, pp. 34-43DOI
Souare P. M. , Fiori V. , Farcy A. , de Crcy F. , Jamaa H. B. , Bor- bely A., Coudrain P. , Colonna J. P. , Gallois-Garreignot S. , Gi- raud B. , Cheramy S. , Tavernier C., Michailos J. , 2014, Thermal effects of silicon thickness in 3-d ics: Measurements and simulations, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, No. 8, pp. 1284-1292DOI
Shin Y. , Kim S. E. , Kim S. , 2016, Thermal assessment of copper through silicon via in 3d ic, Microelectronic Engineering, mAM (Materials for Advanced Metallization), Vol. 156, pp. 2-5DOI
Jain A. , Jones R. E. , Chatterjee R. , Pozder S. , Huang Z., 2008, Thermal modeling and design of 3d integrated circuits, in: 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1139-1145DOI
Ayala J. L. , Sridhar A. , Cuesta D. , 2010, Thermal modeling and analysis of 3d multi-processor chips, Integration, the VLSI Journa, Vol. 43, No. 4, pp. 327-341DOI
Wang F. , Yu N. , 2016, Thermal management of coaxial through- silicon-via (c-tsv)-based three-dimensional integrated circuit (3d ic), IEICE Electronics Express, Vol. 13, No. 11, pp. 20151117-20151117DOI
Liu Z., Swarup S. , Tan S. X. D. , 2013, Compact lateral thermal resistance modeling and characterization for tsv and tsv array, in: 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 275-280DOI
Liu Z. , Swarup S. , Tan S. X. D. , Chen H. B. , Wang H., 2014, Compact lateral thermal resistance model of tsvs for fast finite-difference based thermal analysis of 3-d stacked ics, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 33, No. 10, pp. 1490-1502DOI
Xu H. , Pavlidis V. F. , Micheli G. D. , 2011, Analytical heat transfer model for thermal through-silicon vias, in: 2011 Design, Automation Test in Europe, pp. 1-6DOI
Huang B. , Wu Z. , 2017, The thermal analysis study of 3d bare chip laminated packaging structure, AIP Conference Proceedings, Vol. 1980, No. 1, pp. 040054DOI
Ryu S. K. , Lu K. H. , Jiang T. , Im J. H. , Huang R. , Ho P. S. , 2012, Effect of thermal stresses on carrier mobility and keep-out zone around through-silicon vias for 3-d integration, IEEE Transactions on Device and Materials Reliability, Vol. 12, No. 2, pp. 255-262DOI
Tsai M. Y. , Huang P. S. , Huang C. Y. , Jao H. , Huang B., Wu B. , Lin Y. Y. , Liao W., Huang J. , Huang L., Shih S., Lin J. P. , 2013, Investigation on cu tsv-induced koz in silicon chips: Simulations and experiments, IEEE Transactions on Electron Devices, Vol. 60, No. 7, pp. 2331-2337DOI
Pi Y. , Wang W. , Jin Y., 2016, An accurate calculation method on thermal effectiveness of tsv and wire, in: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), pp. 569-573DOI