Mobile QR Code QR CODE


Lau J. H., 2013, Through-Silicon via for 3D Integration, New York, NY, USA:McGraw-HillGoogle Search
Pan S., Fan J., Oct 2012, Characterization of via structures in multilayer printed circuit boards with an equivalent transmission-line model, IEEE Trans. Electromagn. Compat., Vol. 54, No. 5, pp. 1077-1086DOI
Kim J., Cho J., Kim J., Yook J.-M., Kim J. C., Lee J., April 2014, High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via, IEEE Trans. Compon. Packag. Manuf. Technol., Vol. 4, No. 4, pp. 697-707DOI
LI E.-P., Wei X., Cangellaris A. C., Liu E.-X., Zhang Y., Damore M., May 2010, Progress Review of Electromagnetic Compatibility Analysis Technolo-gies for Packages Printed Circuit Boards and Novel Interconnects, IEEE Trans. Electromagn. Compat., Vol. 52, No. 2, pp. 248-265DOI
Pu B., Kim K., Nah W., 2014, Package design methodology in consideration with signal integrity, power integrity and electromagnetic immunity, 2014 XXXIth URSI General Assembly and Scientific Symposium (URSI GASS), Beijing, pp. 1-4DOI
Marks R. B., Jul 1991, A multiline method of network analyzer calibration, IEEE Trans. Microw. Theory Tech., Vol. 39, No. 7, pp. 1205-1215DOI
Stumper U., 2008, Uncertainties of VNA S-parameter measurements applying the short–open–load–reciprocal (SOLR) calibration method, CPEM Conf. Dig., pp. 438-439DOI
Fleury J., Benard O., pp 26-55, Designing and characterizing TRL fixture Calibration standards for device modeling, Appl. Microw. Wirel., Vol. 13, No. 10, pp. 2001-Google Search
Mostafa Emam, June 26, 2016, RF Characterization – The approach and the advantages, MOS-AK Tutorial Day – ShanghaiGoogle Search
Pozar David M., 2005, Microwave engineering, 3rd., Danvers, MA: WileyGoogle Search
Pu B., Kim K. H., Kim S., Nah W., June 2015, Modeling and Parameter Extraction of Coplanar Symmetrical Meander Lines, Electromagnetic Compatibility IEEE Transactions on, Vol. 57, No. 3, pp. 375-383DOI
Wu S., Fan J., Apr 2012, Analytical prediction of crosstalk among vias in multilayer printed circuit boards, IEEE Trans. Electromagn. Compat., Vol. 54, pp. 413-420DOI
Seo D., Lee H., Park M., Nah W., Feb. 2018, Enhancement of Differential Signal Integrity by Employing a Novel Face Via Structure, IEEE Trans. Electromagn. Compat., Vol. 60, No. 1, pp. 26-33DOI