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  1. (Department of Electronic Engineering, Gachon University, Sujeong-gu, Seongnam-si, Gyeonggi-do 13120, Korea)
  2. (Department of Electronic and Electrical Engineering, Ewha Womans University, 52 Ewhayeodae-gil, Seodaemun-gu, Seoul 03760, Korea)



Integrate-and-fire (I&F), neuron circuit, spiking neural network (SNN), membrane capacitor, shunt capacitor

I. INTRODUCTION

Recently, brain-inspired neuromorphic computing system is gaining great deal of attention as a scalable architecture that outperforms the conventional ones in challenging tasks such as recognition, classification, and perception which usually require high parallelism in data processing [1,2]. For the applications necessitating real-time responsivity, the computer system should continue evolution in terms of compactness, energy efficiency, and data processing cost. Human brain is known to be highly energy-efficient and ultra-light computing system that can be benchmarked in device and circuit renovations towards the goal. Spiking neural network (SNN) provides an effective behavioral model for the human brain, which necessitates synaptic devices and neuron circuits for implementation as an electronic system [3-5]. Synaptic devices based on field-effect transistor (FET) structure and operation principles, and can be relatively easily integrated with the CMOS neuron circuits [6]. Also, emerging memory devices can be employed for synaptic devices with higher synapse array density and further Si processing compatibility is exploited [7-12]. The integrate-and-fire (I&F) neuron circuits are integrated with large array of synaptic devices to realize compact and energy-efficient hardware SNN [13-16]. An I&F neuron circuit generally integrates small currents onto a capacitive component until a threshold is reached [17-21]. As the voltage on the membrane capacitor exceeds the threshold, a digital pulse is generated, fired, and the synaptic weights are modulated. Then, the neuron circuit comes back to a rest. For the higher circuit and system-level simulations, modeling the synaptic devices and neuron circuits should be essential [22,23].

In this work, we make an alteration of a typical complementary metal-oxide-semiconductor (CMOS) neuron circuit for higher compactness. Towards this goal, the size of shunt capacitor is controlled and the effects are closely investigated in terms of I&F behaviors through series of HSPICE simulations. Also, the effects of fluctuation in input current on the response characteristics of the neuron circuit are further studied.

II. NEURON CIRCUIT DESIGN

1. Design Criteria

An I&F neuron circuit schematically shown in Fig. 1 has been designed and simulated by HSPICE. It was assumed that the circuit could be fabricated based on 0.35-${\mu}$m Si CMOS technology. BSIM3 model at level 49 (version 3.1) was used throughout the simulation works. The model parameters describing the MOSFETs implemented by the 0.35-${\mu}$m technology node were included in the circuit simulation: threshold voltage, channel mobility, gate oxide capacitance, and internal parasitic resistances and capacitances of the MOSFETs. The effects of line resistance were not considered since the neuron circuit was designed and analyzed in the stand-alone manner, and the effects of line resistances might not be so critical compared with those in the operations of high-density synapse array. The width and length of the n- and p-type MOSFETs were W = 0.35 ${\mu}$m and L = 0.70 ${\mu}$m, respectively, with the drive voltage (V$_{\mathrm{DD}}$) of 1.0 V. The membrane capacitance (C$_{\mathrm{mem}}$) was set to 0.01 pF. The input current per event was presumed to be 10 pA. The neuron circuit is made up of two parts: one is integrate-and-reset part and the other is trigger-and-fire one. C$_{\mathrm{mem}}$ is responsible for integration of the current signals from the synapse array and has the controllability over firing frequency since the value is the indication of how fast the capacitor is charged. Also, C$_{\mathrm{mem}}$ is closely related with W and L of the NMOSFET (M6) for reset operation of the neuron circuit. The integration is carried out by C$_{\mathrm{mem}}$ as current signals from the synapse array are repeatedly delivered to the neuron. As the integration progresses, the membrane potential (V$_{\mathrm{mem}}$) increases. When V$_{\mathrm{mem}}$ exceeds the threshold voltage (V$_{\mathrm{th}}$) of the NMOSFET (M1), M1 is turned on, by which the high potential at node 1 becomes low. Then, the output node of inverter 1 (INV1) is switched from low to high state, which allows M6 to be turned on and discharge the membrane capacitor completely. The potential at the output node of inverter 2 (INV2) also controls the PMOSFET (M5) before returning to its original state. The rest NMOSFETs (M2 and M3) and PMOSFET (M4) exist for stabilization of respective node states of the neuron circuit. The secondary or shunt capacitor (C$_{\mathrm{s}}$) is usually found in the previous reports as shown in Fig. 1 [24]. The membrane capacitor is indispensable but the shunt capacitor might be optional for realizing the I&F function to operate an SNN. It is found that in previous reports that there can be reasons to employ the secondary capacitor other than signal stability [24,25], such as controllability over spike width and delay. However, for compactness of the neuron circuit, it can be removed safely without a significant loss of functionality. By modulating the size of shunt capacitor, higher compactness can be acquired, which is crucial in implementing a hardware-oriented SNN chip.

Fig. 1. Schematic of the simulated neuron circuit with the indication of location of shunt capacitor, the design variable.
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2. Circuit Operation

The I&F operations of a designed neuron circuit without the shunt capacitor are shown in Fig. 2(a) and (b). V$_{\mathrm{mem}}$ can be expressed in a simple mathematical relation as shown in Eqs. (1) and (2).

(1)
$ I_{in}\cdot t_{pulse}=\Delta V_{mem}\cdot C_{mem} $
(2)
$ \Delta V_{mem}=\frac{I_{in}\cdot t_{pulse}}{C_{mem}} $

Here, I$_{\mathrm{in}}$ and t$_{\mathrm{pulse}}$ are magnitude and width (duration at the top; not the period) of the input current pulse, respectively. The results in Fig. 2(a) and (b) were obtained under the condition that I$_{\mathrm{in}}$ = 10 pA, t$_{\mathrm{pulse}}$ = 0.1~ms, and C$_{\mathrm{mem}}$ = 0.01 pF. By inserting these values in Eq. (2), the increment in V$_{\mathrm{mem}}$ per pulse is obtained to be 0.1 V. The integration is continued until V$_{\mathrm{mem}}$ reaches the V$_{\mathrm{th}}$ of M1, and once V$_{\mathrm{mem}}$ exceeds the threshold, an output spike is generated at the output node of INV1 as depicted in Fig. 2(b). At the same time, C$_{\mathrm{mem}}$ is discharged by M6 and the initial state of the neuron circuit is established (reset). V$_{\mathrm{spk}}$ (firing spike voltage) is the voltage of an output signal and becomes the input signal that modulates the weight of a post-neuron synapse. It is revealed that I&F operations are realized without C$_{\mathrm{s}}$.

Fig. 2. Transient analysis results from the designed I&F neuron circuit. (a) Input current and V$_{\mathrm{mem}}$ vs. time. (b) Spike firing at the output node of the neuron circuit. }
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III. EFFECTS OF THE SECONDARY CAPACITOR

Although it has been demonstrated that C$_{\mathrm{s}}$ can be optional in making up an I&F neuron circuit, for realizing the I&F operation, the effects of C$_{\mathrm{s}}$ can be further investigated. Fig. 3 shows the variation in V$_{\mathrm{spk}}$ as a function of C$_{\mathrm{s}}$. C$_{\mathrm{mem}}$ was set to 0.01 pF and the variation was checked for 20 ms, a long enough time compared with t$_{\mathrm{pulse}}$. Smaller C$_{\mathrm{s}}$ implies that the capacitive coupling between M5 gate and ground is weaker in dealing with a periodically changing signal. As C$_{\mathrm{s}}$ goes smaller, the fluctuation in V$_{\mathrm{spk}}$ becomes larger. On the other hand, larger C$_{\mathrm{s}}$ has an effect of reducing the fluctuation. Thus, it is revealed that there is a trade-off relation between area effectiveness of the neuron circuit and stability in generating identical pulses. Also, the effects of C$_{\mathrm{mem}}$ on neuron circuit have been investigated for the input current pulse with magnitude of 10 pA and duration of 20 ms. It was found that C$_{\mathrm{mem}}$ is negatively correlated with the number of spikes as shown in Fig. 4. This is due to the fact that a larger C$_{\mathrm{mem}}$ requires a longer charging time, which makes a longer time for V$_{\mathrm{mem}}$ to reach threshold voltage as also can be confirmed by Eq. (2). As the result, as C$_{\mathrm{mem}}$ gets larger, the number of firing spikes decreases as shown in Fig. 4.

Number of firing spikes of the designed I&F neuron circuit depends on the amplitude and pulse width of the I$_{\mathrm{in}}$. This dependency of the number of firing spikes is depicted in Fig. 5 and 6. The amount of time for V$_{\mathrm{mem}}$ to reach the triggering threshold voltage decreases either as the I$_{\mathrm{in}}$ pulse width becomes wider or as the amplitude gets larger. Wider I$_{\mathrm{in}}$ pulse increases the number of firing spikes of the I&F neuron circuit as shown in Fig. 5(a). Low inference current is essential for designing a highly energy-efficient hardware SNN system. The inference current in the order of a few picoamperes can be found in the flash memory synaptic devices based on poly-Si channel, and thus, the designed neuron circuit can be suited to the flash SNN architecture. The number of firing spikes increases from 1 to 8 within 10 ms as the current pulse width increases from 0.08 ms to 0.18 ms by an increment of 0.02 ms at an fixed I$_{\mathrm{in}}$ amplitude of 10 pA. Also, the number of firing spikes increases from 3 to 30 within a time window of 10 ms as the amplitude of I$_{\mathrm{in}}$ increases from 10 pA to 50 pA by an increment of 10 pA, at a fixed I$_{\mathrm{in}}$ pulse width and period of 0.1 ms and 10 ms, respectively, as shown in Fig. 5(b). It is explicitly revealed that the adjustment of frequency and amplitude of the input current practically controls the number of firing spikes as depicted in Fig. 6 in which the results in Fig. 5(a) and (b) are summarized. Power and energy consumption analyses are also important factors in designing a neuron circuit, particularly when it comes to one for SNN. The power and energy consumption for the designed I&F neuron circuit per a unit I&F function were calculated to be 1.06 ${\mu}$W and 3.04 nJ, respectively.

Fig. 3. Change in spike voltage as a function of C$_{\mathrm{s}}$.}
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Fig. 4. Number of output spikes from the designed neuron circuit as a function of C$_{\mathrm{mem}}$. }
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Fig. 5. Number of firing spikes as a function of time within 10-ms test window (current amplitude = 10 pA) for (a) different I$_{\mathrm{in}}$ pulse intervals within 10-ms test window (interval is varied from 0.08 ms to 0.18 ms by an increment of 0.02 ms) and for (b) different I$_{\mathrm{in}}$ amplitudes varied from 10 pA to 50 pA by an increment of 10 pA (pulse width = 0.1 ms and period = 10 ms).
../../Resources/ieie/JSTS.2023.23.3.189/fig5.png
Fig. 6. Number of firing spikes as a function of time width and amplitude of the I$_{\mathrm{in}}$ pulse. }
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IV. CONCLUSION

In this work, we have designed and characterized an I&F neuron circuit truncating the shunt capacitor in the conventional neuron circuit, through series of HSPICE simulations, presuming the 0.35-${\mu}$m CMOS technology. The overall frame of the circuit is based on an existing one but one of the major capacitors has been removed aiming higher area efficiency. Functions of the individual capacitors have been closely investigated, with a particular interest in the relation between membrane capacitance and spiking frequency. The results in this work describe how an I&F neuron circuit might properly behave depending on synaptic device parameters in the SNN hardware specifically designed for maximizing the parallelism in data-intensive decision making and would suggest a way to expect higher area efficiency in designing CMOS neuron circuits.

ACKNOWLEDGMENTS

This work was supported by the Korean Ministry of Science and ICT (MSIT) (2021M3F3A2A01037927 and 2022M3I7A1078936). The EDA tool for circuit simulation was supported by IDEC.

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Author

Arati Kumari Shah
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Arati Kumari Shah received the B. Tech. and M. Tech. degrees in electronics and communication engi-neering at North Eastern Regional Institute of Science and Technology, Arunachal Pradesh, India, in 2017 and 2019, respectively. She received the gold medal for the highest score during her master course. She is currently pursuing the Ph.D. degree at Gachon University, Seongnam, South Korea. She worked as a researcher at the National Institute of Technology, Meghalaya, India, where she worked on CMOS technologies and integrated circuits. Her research interests include memory devices and neuron circuits for spiking neural network and mainly focused on circuit design optimally working with various synapse arrays depending on applications.

Eou-Sik Cho
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Eou-Sik Cho received the B.S., M.S., and Ph.D. degrees in the School of Electrical Engineering at Seoul National University, Seoul, Korea, in 1996, 1998, and 2004, respectively. From 2004 to 2006, he was a Senior Engineer at Samsung Electronics, where he worked on the process development of large-size TFT LCD. Since 2006, he has been a member of the faculty at Gachon University, Seongnam, Korea, where he is a currently a Professor with the Department of Electronic Engineering. His current research interests include OLED display manufacturing and tis application to medical devices, fabrication of TFT devices and their applications, light treatment on transparent electrode, semiconductor films on the flexible substrates, and data optimization of electronic devices.

Hyungsoon Shin
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Hyungsoon Shin was born in Seoul, Korea, in 1959. He received B.S. in electronics engineering from the Seoul National University in 1982, M.S. and Ph.D. in electrical engi-neering from the University of Texas at Austin in 1984 and 1990, respectively. From 1990 to 1994, he was with LG Semicon Co., Ltd., in Korea, where he worked on the development of 64M DRAM, 256M DRAM, 4M SRAM, and 4M FLASH memory. Since 1995, he has been a faculty member of the department of electronic and electrical engineering at Ewha Womans University, Seoul, Korea. His present research areas include new processes, devices, and circuit developments and modeling based on Si, both for high density memory and RF IC. He has published numerous journal articles on implant profile models, mobility models, deep-submicron MOSFET structure analysis, current crowding effect in diagonal MOSFET, hot-carrier degradation, alpha-particle-induced soft error, MRAM, ReRAM, PUF, and oxide TFT. He is a senior member of the Institute of Electrical and Electronics Engineers and the Institute of Electronics Engineers of Korea. He received the Technical Excellence Award from the Semiconductor Research Corporation (SRC) in 1991.

Seongjae Cho
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Seongjae Cho received the B.S. and the Ph.D. degrees in electrical engineering from Seoul National University, Seoul, Korea, in 2004 and 2010, respectively. He worked as an Exchange Researcher at the National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Japan, in 2009. He worked as a Postdoctoral Researcher at Seoul National University in 2010 and at Stanford University, Palo Alto, CA, from 2010 to 2013. Also, he worked as a faculty member at the Department of Electronic Engineering, Gachon University, from 2013 to 2023. He is currently working as an Associate Professor at the Department of Electronic and Electrical Engineering, Ewha Womans University, Seoul, Korea, from 2023. His current research interests include emerging memory technologies, advanced nanoscale CMOS devices and process integration, group-IV photonic devices, low-power synaptic devices and neuron circuits for neuromorphic and memory-centric processor technologies. He is a Senior Member of IEEE and a Lifetime Member of IEIE. He was the recipient of the Minister’s Award from the Ministry of Science and ICT of Korea (MSIT) in 2021.