| Title |
Warpage Analysis and Improvement Approach of Transfer-molded Power Semiconductor Modules Considering EMC Properties and Module Structure |
| Authors |
(Jung Su Yoon) ; (Sang Won Yoon) |
| DOI |
https://doi.org/10.5573/JSTS.2025.25.2.154 |
| Keywords |
Warpage; curing shrinkage; CTE; epoxy molding compound; semiconductor package |
| Abstract |
Warpage is a critical issue in semiconductor packages, particularly in molded packages, which are affected by several factors, including shrinkage of epoxy molding compounds (EMCs) during curing and mismatches in coefficients of thermal expansion (CTEs) between adjacent components. This study investigates the impact of EMC properties on the warpage of a power semiconductor module and the feasibility of reducing warpage by appropriately selecting EMC materials. Moldex3D simulation software was used to analyze the combined effects of EMC shrinkage and CTE mismatch. The simulation results show that the thermal conductivity and CTEs of the EMC have a significant impact on package warpage, which can be reduced by 29% with the right selection of EMC. As an additional approach, embedding cooling pins in the EMC encapsulation, anticipating enhanced thermal dissipation and mechanical resistance, was proposed, and an additional ∼ 10% reduction in warpage was demonstrated. |