Mobile QR Code QR CODE

The Journal of Semiconductor Technology and Science (JSTS) is an international, peer-reviewed, and open-access journal that is published bimonthly.
- Scope: semiconductor processes, devices, circuits, and MEMS.
- Editor-in-Chief: Prof. Woo Young Choi (ECE, Seoul National University)
- Indexed within Science Citation Index Expanded (SCIE), SCOPUS, Korea Citation Index (KCI), and other databases.

Journal Search

  1. Home
  2. Archive
  3. 2025-06 (Vol.25 No.03)
  4. 10.5573/JSTS.2025.25.3.311
XML PDF INFO REF

References ▼

[1]

A. Lancaster and M. Keswani, “Integrated circuit packaging review with an emphasis on 3D packaging,” Integration, vol. 60, pp. 204-212, 2018. [CrossRef]

[2]

S. Park, Y. Kim, and S. E. Kim, “Evaluation of 12nm Ti layer for low temperature Cu-Cu bonding,” Journal of the Microelectronics and Packaging Society, vol. 28, no. 3, pp. 9-15, 2021. [CrossRef]

[3]

R. Chanchani, “3D integration technologies - An overview,” Materials for Advanced Packaging, Springer, Boston, MA, pp. 1-50, 2009. [CrossRef]

[4]

P. Ramm, A. Klumpp, J. Weber, N. Lietaer, M. Taklo, and W. de Raedt, “3D integration technology: Status and application development,” Proc. of IEEE ESSCIRC, pp. 9-16, 2010. [CrossRef]

[5]

I. Jani, D. Lattard, P. Vivet, L. Arnaud, S. Cheramy, and E. Veigné, “Characterization of fine pitch hybrid bonding pads using electrical misalignment test vehicle,” Proc. of IEEE 69th Electronic Components and Technology Conference (ECTC), pp. 1926-1932, 2019. [CrossRef]

[6]

F. Niklaus, A. Decharat, F. Forsberg, N. Roxhed, M. Lapisa, M. Populin, F. Zimmer, J. Lemm, and G. Stemme, “Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs,” Sensors and Actuators A: Physical, vol. 154, no. 1, pp. 180- 186, 2009. [CrossRef]

[7]

C. Xu, H. Li, R. Suaya, and K. Banerjee, “Compact AC modeling and performance analysis of through-silicon vias in 3-D ICs,” IEEE Transactions on Electron Devices, vol. 57, no. 12, pp. 3405-3417, 2010. [CrossRef]

[8]

T. Fukushima, H. Kikuchi, Y. Yamada, T. Konno, J. Liang, and K. Sasaki, “New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique,” Proc. of IEEE International Electron Devices Meeting, pp. 985-988, 2007. [CrossRef]

[9]

J. H. Lau, “Recent advances and new trends in nanotechnology and 3D integration for semiconductor industry,” Proc. of IEEE International Conference on 3D System Integration (3DIC), pp. 1-23, 2011. [CrossRef]

[10]

K. Banerjee, S. J. Souri, P. Kapur, and K. C. Saraswat, “3-D ICs: A novel chip design for improving deepsubmicrometer interconnect performance and systems-onchip integration,” Proceedings of the IEEE, vol. 89, no. 5, pp. 602-633, 2001. [CrossRef]

[11]

J. Xie, D. Chung, M. Swaminathan, M. Mcallister, A. Deutsch, and L. Jiang, “Electrical-thermal co-analysis for power delivery networks in 3D system integration,” Proc. of IEEE International Conference on 3D System Integration, pp. 1-4, 2009. [CrossRef]

[12]

J. Xie, D. Chung, M. Swaminathan, M. Mcallister, A. Deutsch, and L. Jiang, “Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration,” Proc. of IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, pp. 113-116, 2009. [CrossRef]

[13]

H. Cai, S. Ma, W. Wang, Y. Jin, J. Chen, and J. Zhang , “Thermal and electrical characterization of TSV interposer embedded with microchannel for 2.5D integration of GaN RF devices,” Proc. of IEEE 68th Electronic Components and Technology Conference (ECTC), pp. 2156-2162, 2018. [CrossRef]

[14]

B. Swinnen, W. Ruythooren, P. de Moor, L. BOgaerts, L. Carbonell, and K. de Munck, “3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 mm pitch through-Si vias,” Proc. of International Electron Devices Meeting (IEDM), pp. 1-4, 2006. [CrossRef]

[15]

J. Xie, D. Chung, M. Swaminathan, M. Mcallister, A. Deutsch, and L. Jiang, “Electrical-thermal co-analysis for power delivery networks in 3D system integration,” Proc. of IEEE International Conference on 3D System Integration, pp. 1-4, 2009. [CrossRef]

[16]

K. H. Lu, X. Zhang, S.-K. Ryu, J. Im, R. Huang, and P. S. Ho, “Thermo-mechanical reliability of 3-D ICs containing through silicon vias,” Proc. of 59th Electronic Components and Technology Conference (ECTC), pp. 630-634, 2009. [CrossRef]

[17]

T. K. M. Tenny and M. Keenaghan, Ohm’s Law, StatPearls, StatPearls Publishing, Treasure Island, FL, USA, 2023.