Synaptic Device with Linear Weight Update Using Graded SiGe Body Capacitor-less 1T-DRAM
Younghoo Ro1
Jun Lee1
Eungi Hwang1
Garam Kim1,*
-
Myongji University, Yongjin, Korea
Copyright © The Institute of Electronics and Information Engineers(IEIE)
Index terms
One transistor dynamic random-access memory, synaptic device, NeuroSim, band-to-band tunneling, neuromorphic device
I. INTRODUCTION
The Neuromorphic computing systems require synaptic devices capable of analog and
linear conductance modulation for accurate weight updates. Although various devices
have been proposed as synaptic devices in previous studies, only a few studies have
investigated the use of capacitor-less 1 transistor DRAM (1T-DRAM) for synaptic applications
[1]. Unlike conventional 1 transistor 1 capacitor DRAM (1T1C-DRAM), the 1T-DRAM stores
data by retaining holes in the floating body of a single transistor [2-
5]. Synaptic devices employed in neuromorphic systems must offer high integration density
to process large amounts of data in parallel, while also ensuring low power consumption
to support the repeated potentiation and depression cycles required during learning.
Several emerging nonvolatile memories (eNVMs), such as RRAM, phase-change memory (PCM/PRAM),
and MRAM, have been widely investigated as synaptic elements. However, their practical
use in online-learning accelerators is often challenged by reliability-related trade-offs,
including limited endurance and pronounced spatial/temporal variability that can degrade
training stability in large-scale arrays [6]. Charge-storage memories such as NAND flash (including 3D NAND) can also be constrained
by the relatively high program/erase voltage and latency/energy overhead, together
with endurance limitations, depending on the target workload. In contrast, DRAM-type
memories inherently provide ultrafast write operation and high endurance, which are
attractive for online training with frequent weight updates [7]. Nevertheless, conventional 1T/1C DRAM suffers from scalability and density limitations
due to the external capacitor. The inherent characteristics of the 1T-DRAM align well
with these requirements. Capacitor-less 1T-DRAM concepts eliminate the storage capacitor
by storing charge within the transistor body/channel (floating-body charge storage),
enabling a simpler cell structure and improved scalability with CMOS-compatible processing
[1]. Furthermore, to achieve high accuracy in machine learning applications using synaptic
devices, it is essential to secure a wide conductance range corresponding to synaptic
weights and to ensure that conductance changes occur as linearly as possible. To meet
these critical requirements, we propose a graded SiGe body 1T-DRAM as a synaptic device.
The device-level characteristics were verified through Sentaurus TCAD simulations,
and the system-level performance was evaluated using NeuroSim [8].
II. NEUROMORPHIC SYSTEM
Neuromorphic computing aims to emulate the structure and functionality of the human
brain to address the inherent limitations of traditional Von Neumann architectures
[9]. As illustrated in Fig. 1(a), the von Neumann model relies on a strict separation between memory and processing
units, which leads to the so-called “von Neumann bottleneck”—a performance limitation
due to frequent data shuttling between memory and processor [10]. In contrast, the neuromorphic architecture shown in Fig. 1(b) co-locates memory and computation, mimicking the decentralized and parallel structure
of biological neural networks [11]. In this model, information is processed directly within memory units, akin to how
biological synapses simultaneously store and transmit signals [12]. A fundamental enabler of this adaptability is synaptic weight, which encompasses
processes such as potentiation and depression, both essential for learning and memory
formation [13]. potentiation strengthens synaptic connections through repeated activation, while
depression reduces them, enabling flexible modulation of synaptic weights. In hardware-based
learning accelerators, achieving high learning accuracy requires these weight updates
to be both linear and symmetric. While many emerging synaptic devices – such as RRAM
and PCM – suffer from nonlinear updates that lead to unpredictable weight jumps and
poor convergence, improving linearity ensures that conductance changes remain proportional
to the applied stimuli. This characteristic is critical for maintaining the precision
of gradient-descent paths in deep architectures like Muli-Layer perceptron (MLP) [14]. To closely replicate the behavior of biological synapses, artificial synaptic devices
must also exhibit additional dynamic properties, such as short-term potentiation (STP),
spike-timing-dependent plasticity (STDP), and the ability to realize multi-level conductance
states [15]. These features are critical for supporting nuanced, time-dependent responses and
ensuring fine-grained control over synaptic weights—key elements for building adaptive,
brain-inspired computing systems. Integrating these plasticity mechanisms into hardware
is essential for achieving real-time learning and energy-efficient processing in neuromorphic
platforms [14].
Fig. 1. (a) Conventional Von Neumann architecture. (b) Advanced neuromorphic architecture.
III. TUNNELING MODEL CALIBRATION
To calibrate the band-to-band tunneling (BTBT) model using the Sentaurus simulation
platform [16]planar Si and SiGe tunnel field-effect transistors (TFETs) were fabricated, as illustrated
in Fig. 2(a) and 2(b). The Si-based TFET employed source and drain implantation using arsenic under identical
conditions on an SOI substrate. In contrast, the SiGe TFET incorporated a 40 nm-thick
Si0.7Ge0.3 layer grown on a lightly p-doped ($1 \times 10^{15}\text{ cm}^{-3}$) SOI (100) substrate,
topped with a Si capping layer. The device further included a 200 nm-thick poly-Si
gate and a 3 nm SiO2 gate dielectric. Both devices featured gate lengths and widths of 400 nm, and their
transfer characteristics were evaluated at a drain voltage ($V_{DS}$) of 1.0 V. Kane’s
model was employed to calibrate the BTBT generation rate ($G$), which is defined under
a uniform electric field as:
where $F_0$ is set to 1 V/m, and $p = 2.5$ for indirect BTBT processes [17]. In this expression, $A$ and $B$ are material-dependent fitting parameters, while
$F$ denotes the local electric field [18,
19]. The best fit to the measured Si TFET data yielded $A = 4 \times 10^{14}\text{ cm}^{-1}\cdot\text{s}^{-1}$
and $B = 9.9 \times 10^6\text{ V/cm}$. For the SiGe TFET, the extracted parameters
were $A = 3.1 \times 10^{16}\text{ cm}^{-1}\cdot\text{s}^{-1}$ and $B = 7.1 \times
10^5\text{ V/cm}$, demonstrating good agreement between the simulated and measured
transfer characteristics. Furthermore, we included Shockley–Read–Hall (SRH) recombination
with doping-dependent lifetimes to properly capture recombination effects in heavily
doped regions [20]. We also utilized a doping-dependent mobility model to account for the reduction
in carrier mobility at high impurity concentrations, which was crucial for accurately
modeling carrier transport across the SiGe gradient. We also enabled the Multivalley
(MLDA) carrier transport model to reflect the multiple conduction band and employed
Fermi–Dirac statistics instead of the simpler Maxwell–Boltzmann approximation, as
the devices operate in a high-injection regime during write operations. Finally, the
effective intrinsic density model was applied without bandgap narrowing, as our simulations
focus on the body region where the graded SiGe composition remains within a range
that does not necessitate explicit bandgap narrowing modeling. Altogether, these models
ensured that the simulation results—particularly the transient behavior of hole storage
and conductance modulation—reflect realistic physics in the proposed 1T-DRAM structure.
Fig. 2. Cross-sectional view of the (a) Si TFET; (b) SiGe TFET.
Fig. 3. Calibrated transfer curves of SiGe and Si TFET.
IV. DEVICE STRUCTURE AND ANALYSIS
To improve the learning accuracy of neuromorphic systems employing synaptic devices,
it is essential to ensure a wide conductance range that can vary according to the
learning process. In the case of a 1T-DRAM, this requires increasing the amount of
holes that can be stored in the floating body. To achieve this, the structure proposed
in this study utilizes a SiGe body to form a well for hole storage by exploiting the
valence band offset between Si and SiGe. In addition, securing good linearity in conduc-
tance change the body and drain more difficult. Conse- quently, the conductance variation
range decreases simi- larly, during process, as the hole is crucial for enhancing
learning accuracy. During repeated potentiation cycles in a 1T-DRAM, the accumulation
of holes in the body low- ers the energy band, which makes band-to-band tunneling
(BTBT) between concentration in the body decreases the energy band rises, making it
harder to extract the stored holes from the well to the drain, which also reduces
the conductance variation range. This reduction in conductance modulation during potentiation
and depression leads to degraded linearity, which negatively impacts the learning
accuracy. To address this issue, we propose a graded SiGe body structure in which
the Ge content decreases toward the drain side. Fig. 4 shows the proposed 1T-DRAM-based synaptic device with a graded SiGe body, divided
into three segments with decreasing Ge mole fractions (0.3, 0.2, 0.1) from source
to drain. In this configuration, holes are mainly stored in the body region near the
source. As a result, the energy band near the drain remains less affected during the
potentiation and depression processes. This helps maintain a stable and linear conductance
change even when potentiation and depression cycles are repeated, thereby improving
the learning accuracy of the synaptic device. To evaluate the synaptic behavior of
the proposed 1T-DRAM structure, device-level simulations were conducted using the
parameters summarized in Tables 1 and 2. Table 1 details the physical design parameters, including gate length, body thickness, and
the SiGe composition profile across the body region. To maintain consistency in evaluating
synaptic performance across devices with varying Ge content, the read voltage conditions
were carefully tailored.
Fig. 4. Schematic of the proposed 1T-DRAM based synaptic device structure with a graded
SiGe body.
Table 1. Parameters of the proposed structure.
|
Parameters
|
Values
|
|
Gate length
|
150 nm
|
|
Each SiGe body length
|
50 nm
|
|
Body thickness
|
100 nm
|
|
Box thickness
|
30 nm
|
|
Gate oxide thickness
|
1 nm
|
|
Gate work function
|
4.05 eV
|
Table 2. Condition used for numerical simulation of the proposed structure.
|
|
Gate (V)
|
Drain (V)
|
Source (V)
|
|
Potentiation
|
-0.7
|
1.4
|
0
|
|
Hold
|
-1
|
0
|
0
|
|
Depression
|
0.02
|
-0.2
|
0
|
|
Read
|
0.3
|
1
|
0
|
Fig. 5. Operation processes of the proposed structure: (a) potentiation and (b) depression.
Since a fixed read voltage would produce varying initial drain currents due to composition-dependent
threshold voltages, adjustments were made to align the baseline read currents, ensuring
a fair assessment of conductance modulation. As shown in Fig. 5(a), during the potentiation operation, a negative gate voltage and a positive drain
voltage are applied simultaneously. This biasing condition induces BTBT near the drain-side
junction, resulting in hole injection into the body. The injected holes migrate and
accumulate primarily in the high-Ge region near the source due to its elevated valence
band edge and deeper quantum well. Unlike the conventional structure, in which an
increase in hole concentration shifts the entire energy band of the body, thereby
suppressing BTBT between the body and the drain, the proposed graded SiGe structure
confines most of the holes to the body region adjacent to the source. As a result,
BTBT is relatively maintained during the potentiation process. This enables holes
to be stored continuously in the body during the repeated potentiation process, thereby
ensuring the linear conductance modulation and the wide separation between the minimum
conductance ($G_{min}$) and maximum conductance ($G_{max}$) required for accurate
and reliable learning in neuromorphic computing. As shown in Fig. 5(b) during the depression operation, a positive gate voltage and negative drain voltage
are applied, facilitating hole extraction toward the drain. In the conventional structure,
a reduction in hole concentration during the depression process raises the entire
energy band of the body, thereby increasing the height of the valence band barrier
encountered by holes moving toward the drain, which makes depression difficult. In
contrast, in the proposed structure, the barrier height experienced by holes stored
in the body is maintained at a relatively constant level, resulting in a more linear
conductance change during the depression process. The synaptic weight update was programmed
via simultaneous gate and drain voltage pulses, as illustrated in Fig. 6(a) and 6(b) presents the temporal waveform of the gate and drain voltage pulses used to induce
BTBT-based programming in the proposed 1T-DRAM synaptic device. Specifically, the
drain and gate pulses are applied simultaneously, with a pulse width of 10 ns and
a uniform inter-pulse spacing to allow sufficient time for charge stabilization. Fig. 7(a) and 7(b) illustrate the real-time evolution of the drain current as a function of the number
of applied programming pulses. This measurement is taken immediately after each BTBT-induced
write pulse, thereby capturing the cumulative change in conductance of the proposed
1T-DRAM synaptic device. As observed, the drain current exhibits a monotonic and gradual
increase with successive pulses. This behavior directly reflects the incremental accumulation
of hole charge within the body region, injected via band-to-band tunneling at the
drain–body junction [21]. Each individual pulse contributes a discrete quantity of charge, which translates
into a measurable increase in channel conductance. The result is a quasi-linear staircase
profile, characteristic of analog potentiation behavior. However, simulations indicate
that synaptic devices with a uniform SiGe composition across the entire channel—illustrated
in Fig. 8(a) for Ge mole fractions of 0.1, 0.2, and 0.3—exhibit rapid conductance saturation and
degraded linearity. While a higher Ge content leads to an increased difference between
the minimum and maximum conductance values, it also results in accelerated hole accumulation
throughout the body, which in turn compromises the linear modulation of conductance.
This nonlinearity adversely affects the precision of synaptic weight updates, thereby
limiting the learning performance. The corresponding hole density profiles shown in
Fig. 8(b)-8(d) further corroborate these findings. As the Ge concentration increases, the body region
becomes uniformly saturated with holes, making it difficult to achieve incremental
and controllable weight tuning. To address these limitations, a graded SiGe composition
profile was introduced, where the Ge content is gradually reduced from source to drain
(e.g., Si0.7Ge0.3 → Si0.8Ge0.2 → Si0.9Ge0.1). The potentiation and depression characteristics of this configuration, presented
in Fig. 9(a) under identical biasing conditions, demonstrate significantly enhanced linearity
compared to uniform counterparts. This improvement is attributed to the spatially
engineered charge storage dynamics enabled by the graded composition. Although the
reduced BTBT rate in the lower-Ge regions inherently limits the total amount of hole
injection, this limitation can be effectively mitigated by increasing the gate voltage
during programming [22]. Under such conditions, the proposed graded structure is Capable of achieving a wide
conductance window while maintaining excellent linearity. This observation implies
that, even with enhanced hole injection, the device can preserve its analog modulation
characteristics due to the spatial confinement and asymmetric energy barriers inherent
to the graded profile. As further evidenced in Fig. 9(b), the graded body structure promotes localized hole accumulation near the high-Ge
source region, forming a stable charge reservoir and suppressing back-diffusion. This
not only enhances charge retention and reduces variability but also enables the realization
of multiple, well-separated conductance states. These results strongly suggest that
the proposed device architecture is highly promising for neuromorphic systems, offering
both linear and high-resolution weight modulation—key attributes for achieving superior
recognition performance in neural network applications.
Fig. 6. (a) Potentiation voltage pulses and (b) depression voltage pulses.
Fig. 7. Read current evolution following each (a) potentiation pulse and (b) depression
pulse.
Fig. 8. (a) Potentiation and depression curves for SiGe body with varying Ge content.
(b)-(d) corresponding hole density profiles for each uniform composition after 20
and 60 potentiation cycles.
Fig. 9. (a) Potentiation and depression curves of the graded SiGe body. (b) Hole density
profile of the graded body in 20 and 60 potentiation cycles.
V. IMAGE RECOGNOTION ACCURACY
To assess the learning and inference capabilities of the proposed synaptic device,
we employed a multilayer perceptron (MLP) neural network simulation using NeuroSim
V3.0. The network architecture consists of 400 input neurons, 100 hidden neurons,
and 10 output neurons, as illustrated in Fig. 10(a). The input layer processes $20\times 20$-sized MNIST handwritten digit images, with
classification into 10 numerical classes (0–9). A total of 60,000 training samples
and 10,000 test samples were used to evaluate synaptic learning performance [13]. Fig. 10(b) shows how a single layer in Fig. 10(a) can be implemented using a synaptic crossbar array. The input activations are applied
as voltages along the row lines, and each cross-point cell stores a programmable conductance
that represents the synaptic weight between an input node and an output node. The
currents collected on each column naturally sum the contributions from all input rows,
producing the weighted-sum output of a fully connected layer. Accordingly, the 400-to-100
connection in can be mapped to a $400 \times 100$ synaptic array as illustrated in
Fig. 10(b). In neuromorphic systems, synaptic plasticity is typically realized through potentiation
and depression, where the conductance of the synaptic device should ideally change
linearly with the number of input pulses [23]. However, in practice, most emerging memory-based Synaptic devices—including our
proposed 1T-DRAM synapse—exhibit non-linear weight update behavior. This deviation
leads to a mismatch between the desired and actual conductance states, which can compromise
learning accuracy [17]. To model this behavior, we adopt a generalized exponential model that describes
conductance modulation during potentiation and depression as a function of the number
of pulses as follows:
where $G_{LTP}$ and $G_{LTD}$ are the conductance for potentiation and depression,
respectively, and $P$ is number of pulses. As shown in Fig. 8, where $G_{max}$, $G_{min}$, and $P_{max}$ are experimentally extracted parameters,
and $A$ governs the degree of nonlinearity [9]. This model is used to fit the experimentally observed conductance behavior of our
device, and nonlinearity values of potentiation and depression ($NL_{LTP}$ and $NL_{LTD}$)
are extracted to quantify linearity. Lower absolute values of NL indicate better linearity,
which is crucial for reliable synaptic learning [24]. As demonstrated in Fig. 11(a), the proposed graded-body synaptic device achieves improved linearity under enhanced
gate voltage conditions. A total of 60 potentiation and 60 depression pulses were
applied, and the resulting drain current exhibits a smooth, near-linear increase during
potentiation, followed by symmetric depression. This behavior confirms the device’s
ability to support analog, symmetric weight updates, which are essential for training
accuracy [25,
26]. Fig. 11(b) shows the hole density distribution in the body region of the proposed device after
20 and 60 potentiation cycles. Owing to the graded SiGe profile, holes are predominantly
stored in the source-side Si0.7Ge0.3 region, and the sustained BTBT during the potentiation process enables a continuous
increase in hole concentration until 60 potentiation cycles, reaching a peak density
of $1.98 \times 10^{19}\text{ cm}^{-3}$. This efficient hole storage mechanism prevents
early saturation of conductance and facilitates the realization of a wide and linear
conductance window. To benchmark the system-level performance of the proposed synaptic
device, recognition accuracy was evaluated using the electrical and structural parameters,
as summarized in Table 3. Regarding the selection of operating bias conditions, the voltages were carefully
optimized based on the physical characteristics of the proposed graded SiGe body.
Due to this structural asymmetry, the BTBT process, which governs hole injection from
the drain during write operations, is significantly influenced by the local Ge concentration.
Specially, the lower Ge content near the drain reduces the BTBT rate compared to the
source side. To ensure that a sufficient volume of holes is injected and retained
within the body reservoir, we fixed the drain voltage to stabilize the BTBT ratio
and swept the gate voltage to precisely control the amount of accumulated charge.
The selected optimized gate voltage range was determined to maximize the conductance
modulation window while maintaining stable injection dynamics. In addition, Table 4 presents the fitting parameters used in the configuration for NeuroSim simulations.
These include nonlinearity coefficients for both potentiation and depression, where
the graded SiGe body structure demonstrates superior linearity compared to uniform
SiGe body configurations. This numerical evidence underscores the device’s enhanced
capability for accurate weight modulation. Fig. 11(c) illustrates normalized conductance responses of the proposed structure fitted to
NeuroSim’s nonlinearity model. These curves highlight that the graded SiGe structure
exhibits more linear conductance progression than the conventional uniform SiGe body
structures, which is critical for accurate learning in neuromorphic networks. Furthermore,
Fig. 12 presents the recognition accuracy results obtained using three device types: uniform
SiGe body structures with Ge fractions of 0.1 and 0.2, and the proposed graded SiGe
device under identical bias conditions, and the graded device under an enhanced gate
voltage of −3.3 V, which yielded the best overall performance Notably, the device
with a uniform Ge content of 0.3 was excluded from the accuracy evaluation due to
its severely degraded linearity, which makes it unsuitable for use as a synaptic device.
The proposed device achieved a peak recognition accuracy of 84.9%, with average accuracy
of 73.61%. These results clearly demonstrate the advantage of the graded SiGe profile
in delivering both high linearity and wide dynamic range—two essential properties
for achieving reliable and accurate recognition in neuromorphic applications [24].
Fig. 10. (a) MLP (Multilayer Perceptron) network utilized for image recognition, (b)
Synaptic array configuration.
Fig. 11. (a) Potentiation/depression curves of the graded SiGe synaptic device, (b)
Hole density of the graded SiGe synaptic device after 20 and 60 potentiation cycles,
(c) Normalized conductance of graded body.
Table 3. Optimized condition used for the proposed device.
|
|
Gate (V)
|
Drain (V)
|
Source (V)
|
|
Potentiation
|
-3.3
|
1.4
|
0
|
|
Hold
|
-1
|
0
|
0
|
|
Depression
|
0.25
|
-0.02
|
0
|
|
Read
|
0.3
|
1
|
0
|
Table 4. Nonlinearity (NL) of the conductance.
|
Structure
|
NLLTP
|
NLLTD
|
|
Si0.9Ge0.1
|
1.92
|
-5.73
|
|
Si0.8Ge0.2
|
6.07
|
-5.35
|
|
Si0.7Ge0.3
|
7.35
|
-5.56
|
|
Graded body
|
1.71
|
-5.17
|
|
Graded body (optimized)
|
0.74
|
-4.16
|
Fig. 12. Recognition accuracy comparison between uniform SiGe body devices and the
proposed graded SiGe body structure.
VI. PROCESS FLOW
To achieve high integration density while enabling controllable formation of a compositionally
engineered SiGe body, a vertically oriented channel architecture on a bare silicon
wafer is adopted. The device fabrication begins on a bare silicon wafer where a common
source region is first defined by n+ implantation and activation annealing. To form the charge-storage body, epitaxial
growth of SiGe is performed on the source region while gradually tuning the Ge fraction
to create a vertically graded composition. This graded SiGe stack enables controlled
band engineering within the body region (Fig. 13 (a)). Next, a hard mask is patterned and anisotropic dry etching is carried out to define
vertical channel pillars extending down to the common source (Fig. 13(b)). After pillar formation, a gate dielectric layer is grown along the vertical channel.
A conductive gate layer is then deposited, followed by anisotropic etch-back to leave
the gate material on the sidewalls, thereby forming the word line through a spacer-based
sidewall technique (Fig. 13(c)). Finally, metal patterning process is performed to establish the drain lines (bit
lines), completing the vertical 1T-DRAM structure with a graded SiGe body (Fig. 13(d)).
Fig. 13. (a) Epitaxial growth of a vertically graded SiGe body on the common source
region. (b) Definition of vertical channel pillars through lithography and anisotropic
dry etching. (c) Formation of the gate stack by gate dielectric growth followed by
sidewall spacer-based gate (word line) creation. (d) Drain contact metal patterning
to establish the bit line interconnection.
VII. CONCLUSIONS
In this work, we proposed a 1T-DRAM structure with graded SiGe channel for synaptic
devices and demonstrated its superiority over conventional uniform SiGe body configurations
in terms of linearity and conductance modulation. In uniform SiGe body structures
(e.g., Si0.9Ge0.1, Si0.8Ge0.2, Si0.7Ge0.3), hole accumulation occurs uniformly throughout the body during the potentiation
operation. This results in rapid and nonlinear increases in conductance during repeated
pulses, ultimately breaking the linearity required for accurate weight updates. Moreover,
the conductance window (Gmax – Gmin) degrades over successive potentiation cycles, limiting learning accuracy and reliability.
In contrast, the proposed device utilizes a spatial gradient in the SiGe composition
(e.g., Si0.7Ge0.3 near the source to Si0.9Ge0.1 near the drain), which enables selective hole confinement and improved conductance
linearity. Even under strong write conditions (–3.3 V gate bias), the device maintains
excellent linearity while achieving a wide conductance range. As a result, the proposed
structure effectively overcomes the key limitations of conventional uniform SiGe body
devices and offers a promising solution for high-performance neuromorphic systems
with enhanced learning accuracy and device reliability.
ACKNOWLEDGEMENTS
This work was supported in part by the National Research Foundation of Korea (NRF)
grant funded by the Korea government (MSIT) RS-2025-16903034, RS-2026-25536380, and
in part by the “Gyeonggi Regional Innovation System & Education Project (Gyeonggi
RISE Project)” funded by the Ministry of Education and Gyeonggi Province. The EDA
tool was supported by the IC Design Education Center (IDEC), Korea.
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Younghoo Ro received the B.S. degree in Electronic Engineering from Myongji University,
Yongin, Korea, in 2026. He worked as an intern at RadiusXR in the San Francisco Bay
Area, California, USA, as a member of the Hardware Design Team. He is currently working
as a GSS RAPID Division Customer Support Engineer at KLA Korea. His current research
interests include capacitor-less 1T DRAMs, 4H-SiC power devices, and neuromorphic
devices.
Jun Lee received the B.S. degree from the Department of Electronic Engineering from
Myongji University, Yongin, Republic of Korea, where he is currently pursuing an M.S.
degree. His current research interests include neuromorphic devices, capacitor-less
1T DRAMs, and tunnel FETs.
Eungi Hwang received the B.S. degree from the Department of Electronic Engineering
from Myongji University, Yongin, Republic of Korea, where he is currently pursuing
an M.S. degree. His current research interests include capacitor-less 1T DRAMs, tunnel
FETs, and neuromorphic devices.
Garam Kim received the B.S. and Ph.D. degrees in electrical engineering from Seoul
National University, Seoul, Korea, in 2008 and 2014, respectively. He worked as a
senior engineer at Samsung Electronics from 2014 to 2019. In 2019, he joined the Division
of Electrical and Electronic Engineering at Myongji University, Yongin, Republic of
Korea, where he is currently an associate professor. His current research interests
include capacitor-less 1T DRAMs, GaN-based LEDs, GaN HEMT, tunnel FETs, neuromorphic
devices, and CMOS image sensors.